Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To eliminate the deviation of aligning the wirings of a circuit substrate and connecting wirings by forming the wirings of the substrate and the connecting wirings for connecting the outer terminal of a semiconductor chip in the same manufacturing step. CONSTITUTION:A filler 4 is filled in the hole 2B of a circuit substrate 2, and a semiconductor chip 3 is buried in the hole. A wiring forming layer 5 is formed on a whole surface including them on an interlayer insulating film 2C of the substrate 2 on the passivation film 3D of the chip 3. Then, the layer 5 is coated with a photoresist film. An etching mask 7 is formed by patterning it in a predetermined shape by photolithography. The layer 5 is etched with the mask 7, and connecting wirings 5A and wirings 5B are formed in the same manufacturing step. The layer 5 is etched by anisotropic dry etching, and the mask 7 is removed.

Inventors

• 👤 Shinichi Shoji

Bibliographic Details