Application of protective film to semiconductor wafer

Abstract

Abstract PURPOSE:To cut finally, automatically the protective film which is pasted up on the treated face of a wafer and is out roughly, by arranging in a row a plurality, of rotating grinding machines having different grinding conditions. CONSTITUTION:A final cutting part 4 is equipped with a sucking stage 27 where a wafer 9 is placed after positioning as well as rotating grinding machines 28, 29, and 30 which are arranged in a row along the periphery of the wafer 9 where a protective film is pasted. The above machines 28, 29, and 30 are connected to a grinding controller 35 through arms 32, 33, and 34 and also have adjusting functions such as pressure bar pressure towards the wafer 9 or fine stroke and the like. Further, having different grinding face conditions, the above machines are established so that they may have states of further refined faces in order towards the rotating direction of the wafer 9. Grindings carried out by the above machines 28, 29, and 30 at the periphery of the protective film 12' are performed in the three steps continuously and the protective film 12' is out finally into the perfectly same size that the wafer 9 has.

Inventors

• 👤 Tsutomu Harada
• 👤 Hiroyuki Ikeda
• 👤 Suteo Ogawa

Bibliographic Details