Semiconductor integrated circuit

Abstract

Abstract PURPOSE:To improve electrical characteristics, by providing this integrated circuit with the following parts: a mount part where a semiconductor pellet is mounted, a plurality of lead terminals, and a bonding part which is formed to have at least one position on a region between the mount part and the lead terminals so as to surround a periphery of the mount part and capable of being directly connected to the external parts. CONSTITUTION:Pads 21, 22, 23 on a semiconductor pellet 1 are connected respectively to lead terminals 11, 13, 4. A pad 31 is connected to the pad 21 by the use of metallic wiring inside the semiconductor pellet 1. The pad 31 is connected to a bonding pad 3 so that it is made equipotential to the pad 21. Assuming that a resistance of a bonding wire from the lead terminal 11 to the pad 21, a resistance of the metallic wiring from the pad 21 to the pad 31 on the semiconductor pellet 1, a resistance of the bonding wire from the pad 31 to the bonding part 3, and a resistance of the bonding part 3 are R1, R2, R3, and R4, respectively, an equation R1+R2+R3<<R2 is generally defined. Accordingly the apparent resistance of the metallic wiring can be reduced.

Inventors

• 👤 Mikio Koike

Bibliographic Details