Printed wiring board for ic card

Abstract

Abstract PURPOSE:To realize an IC card with a smooth surface and a fine appearance and avoid the breakdown of the IC card caused by a mischief from curiosity by a method wherein the electric signal transmission patterns of the printed wiring board for the IC card are branched or patterns which do not contribute to the electric signal transmission are formed to reduce the unevenness of the surface of a packaging film. CONSTITUTION:After a hole 2 for mounting a semiconductor is formed in a printed wiring board 1 made of glass-epoxy resin, polyester resin or the like by punching or drilling, a copper foil which is a metal foil is applied by pressing. An etching mask which has portions forming gaps 3a to cut off the continuity between the metal foil patterns is composed of a dry film or a film of photosensitive resin such as liquid resist and applied and required conductor patterns are formed by etching. After that, necessary plating is applied with Au, Su, copper, solder or the like to complete the printed wiring board for an IC card. With this constitution, the unevenness of the surface of the IC card can be significantly reduced and the appearance can be significantly improved and, moreover, the breakdown of the IC card caused by a mischief can be avoided.

Inventors

• 👤 Atsushi Hiroi
• 👤 Yasuhiro Horiba
• 👤 Nobuhito Hayashi

Bibliographic Details