Mounting method for electronic component

Abstract

Abstract PURPOSE:To obtain a mounting method where electronic components of a general purpose semiconductor device or the like can be densely mounted at low cost and in high yield by a method wherein the electronic components are fixed to a substrate through the intermediary of a bump by pressure under heating so as to mount the electronic components on a circuit wiring substrate. CONSTITUTION:For instance, a plating mask 3 with aperture windows 3' 5-150mum in diameter is formed out of glass calcined at low temperature on a conductive film 2 of ITO material so as to be a bump forming substrate 10. And then, gold is selectively plated onto the aperture windows 3' of the mask 3 of the bump forming substrate 10 through an electroplating method for the formation of the bump source 4a. Next, an aluminum lead-out electrode 5 formed on a lower substrate 6 where an LSI chip is to be mounted is made to be position-aligned with the bump source 4a on the bump forming substrate 10, and then the bump source 4a is transferred onto the lea-out electrode 5 for the formation of a bump 4b. And, the lower substrate 6 provided with the bump 4b is made to be connected with an LSI chip.

Inventors

• 👤 Hironori Murakami

Bibliographic Details