Resin sealed semiconductor device

Abstract

Abstract PURPOSE:To perform packaging of a lead frame with all the external leads connected stably, by adhering a low-melting-point metal film on a part of one face of each of the external leads such that the lead is thicker at that part than the other parts. CONSTITUTION:A lead frame 1a includes external leads 4 each having a low- melting-point metal film 11 adhered on a part of one face thereof so as to be thicker in that part than the other parts. The thickened part by the metallic film 11 provides a bonding face 9. According to such arrangement, even if any variance in contact is caused between the bonding face 9 and a packaging face 10 when the lead frame is packaged by reflowing, the metallic film 11 having a sufficient thickness will absorb such variance. Accordingly, packaging can be realized with all the external leads 4 bonded stably.

Inventors

• 👤 Akihiro Kubota

Bibliographic Details