Surface attaching packaging printed wiring board

Abstract

Abstract PURPOSE:To reduce the occurrence of short circuits by depositing a chemical copper plating on the conductor lands at the time of the surface attaching packaging, to form a copper film on the upper surface of the conductor lands, and forming an arc section having the radius of the same size as the height of the conductor lands on both end faces in the arrangement direction and on the shoulder sections. CONSTITUTION:A plurality of conductor lands 4 are placed on a base material a with an interval, consisting of a conductor circuit 2' formed of 1 copper foil 2, and a copper film 3' formed on the upper surface of the conductor circuit 2' and on both end faces in the arrangement direction by depositing a chemical copper plating 3. The copper film on both end faces 4b are formed in an arc having a radius of the same size as the height of the conductor lands 4. With this set-up, the short-circuit failures between the conductor lands at the surface attaching packaging time can be reduced, and the height of each conductor land is lowered to reduce the amount of a solder paste used at the surface attaching time, thereby enabling the improvement of the quality and the reduc tion of the manufacture cost.

Inventors

• 👤 Shusaku Izumi

Bibliographic Details