Soldering device

Abstract

Abstract PURPOSE:To improve the workability in soldering by providing a nozzle feeding a pressurized air and opening it in opposition to the through hole for an electronic part of one part of the above of a printed circuit board as well. CONSTITUTION:The frame 12 holding a printed circuit board 3 freely detachably at both ends is provided and a nozzle 13 is arranged as well freely liftably to the upper part of the board 3. The electronic part 4 washable by an org. solvent is inserted into a through hole 5 and when the board 3 removing the oxidized film is carried in, the frame 12 is dipped in a solder 2. The nozzle 13 is then descended and a pressurized air is injected from a tip part 13b to blow off the solder 2 flowed in the through hole 6 of the electronic part unwashable by the org. solvent. The solder clogging of the through hole 6 is thus prevented and the soldering work of the part unwashable by the org. solvent is facilitated and simplified. Consequently the soldering workability is improved.

Inventors

• 👤 Hiroo Shirahama

Bibliographic Details