Hybrid integrated circuit

Abstract

Abstract PURPOSE:To improve moisture resistance and cleaning resistance by providing a first resin layer covering an electronic component and a substrate, a second resin layer impregnated with wax covering the first layer, and a third resin layer covering the second layer. CONSTITUTION:An aluminum substrate 1, a component, such as a semiconductor IC 2 placed on the substrate 1 and a phenol precoat 4 are covered with phenol resin 6, which is covered with a wax layer 7 in which the resin 6 is impregnated with wax. The layer 7 in which the resin 6 is impregnated with wax is further covered with a phenol resin 8. Thus, the wax intermediate layer 7 is provided between the resins 6 and 8 to improve moisture resistance and cleaning resistance.

Inventors

• 👤 Takeshi Nakajima

Bibliographic Details