Apparatus for supplying solder to surface mounting part

Abstract

Abstract PURPOSE:To make it possible to supply a solder to the surface mounting parts on a substrate with a fixed height without damaging the circuit pattern by using a device having a noncontact detection section as the copying member, and moving it. CONSTITUTION:A cylinder 12 containing a cream solder and having a nozzle 13 attached to the terminal thereof is connected to a pressure device, and attached along with a copying device 14 to a connecting and holding device 15 which is movable in a Z-direction. The copying device 14 consists of a suction nozzle 18 placed slightly above a substrate 17 which is placed on an XY-table 16, and a suction device connected through a vacuum gauge, and the degree of proximity of the terminal of the suction nozzle 18 to the substrate 17 is detected by the degree of vacuum. And the detected degree of proximity to the substrate 17 is outputted to the connecting and holding device 15 as an electric signal, by which the movement in the Z-direction is controlled through feedback. In such supplying apparatus 19, the position of the connecting and holding device 15 in the Z-direction is controlled by the degree of vacuum of the terminal of the suction nozzle 18 in a noncontact manner with the substrate 17, and simultaneously, the heights of the cylinder 12 and the solder supply nozzle 13 are controlled to be constant.

Inventors

• 👤 Katsuhiko Kaneda

Bibliographic Details