Solid-state image sensor

Abstract

Abstract PURPOSE:To form a wiring by a lead, to stick a transparent cap to a sensor section with adhesives or sealing the cap to the sensor section with transparent glass or a resin and to miniaturize a video camera and reduce cost thereof by directly assembling a solid-state image sensor onto a printed board. CONSTITUTION:A solid-state image sensor 2 is stuck onto the surface of a printed board 1 consisting of bakelite or ceramics with silver paste, etc. The image sensor 2 is connected to wirings for the printed board 1 by leads 3 consisting of aluminum, copper, etc., and assembled. A transparent cap 5 is pasted onto the surface of the printed board 1 including the image sensor 2 with adhesives 4 composed of epoxy adhesive low melting-point glass. The solid-state image sensor 12 is assembled onto the surface of the printed board 11 together with the leads 13 in another case, and the upper section of the image sensor 12 is molded with transparent glass or a resin 15, thus miniaturizing a video camera and reducing cost thereof.

Inventors

• 👤 Seiichi Iwamatsu

Bibliographic Details