Reflow soldering

Abstract

Abstract PURPOSE:To reduce soldering defects and reduce man-hours for solder amendment in a later process significantly by applying a fine vibration to a mounted component in a solder melting process. CONSTITUTION:When solder is heated to the temperature higher than the solder melting point in a solder melting process and the solder is in the melted state, a fine vibration such as an ultrasonic vibration is applied to a chip component 6 by a fine vibration generator 1. Therefore, the friction resistance between the melted solder and the chip component is reduced and self-alignment is effectively achieved so that the chip component can be matched with the center of a land and the solder is solidified as it is by a cooling process and a solder connection is achieved. With this constitution, soldering defects such as the discrepancy of the component can be avoided.

Inventors

• 👤 Masaru Denda

Bibliographic Details