Lead frame of semiconductor device

Abstract

Abstract PURPOSE:To prevent inner leads from being deformed and being contaminated by a gas so as to improve reliability of a semiconductor device, by using a low-melting-point glass to hold tip parts, which are out of a plurality of inner leads and at least face a tab, on their united states. CONSTITUTION:A low-melting point glass 8 is stuck in a square frame shape on a rear side of a semiconductor substrate at tip parts of inner leads 3 which face a tab 2. This low-melting-point glass 8 is partially melted and interposed between relatively adjacent inner leads 3. The tip parts of the respective inner leads 3 are united solidly to each other and held by this low-melting-point glass 8. The tip parts, which are mechanically weakest, can be prevented from being deformed and besides positions of the tip parts and a dimension of an interval between adjacent leads can be prevented from being varied. Wires connected between a semiconductor element mounted on the tab 2 and the tip parts of the inner leads 3 can be bonded suitably, and opening defect during the bonding process can be prevented. The adjacent leads can be also prevented from short- circuiting to each other.

Inventors

• 👤 Seiji Goto

Bibliographic Details