Semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To contrive a reduction in the impedance of a power supply without increasing the size of a chip by a method wherein power wirings are provided on a memory cell array. CONSTITUTION:Power wirings 5a and 5b and wirings 6 for reinforcing word lines, which are extended to the direction parallel to the long sides of a semiconductor chip 1, are provided on a memory cell array M-ARY. These wirings 5a, 5b and 6 are all constituted of a second-layer Al film, for example. Using these power wirings, the power wiring of a semiconductor integrated circuit device can be reinforced without increasing the size of the chip. Accordingly, a reduction in the impedance of a power supply can be contrived without increasing the size of the chip.

Inventors

• 👤 Shuichi Miyaoka
• 👤 Nobuo Tanjiyou
• 👤 Toshikazu Arai
• 👤 Hiroshi Higuchi
• 👤 Hisayuki Higuchi

Bibliographic Details