Resin sealed type semiconductor device

Abstract

Abstract PURPOSE:To obtain a package structure characterized by excellent moisture resistance reliability, solder moisture resistance and to crack resistance, by providing an insulator comprising a thermoplastic-resin bonding agent or a thermosetting-resin bonding agent, in which organic filler having a specified grain diameter is compounded, and junctioning the facing surfaces of a semiconductor element and inner leads with said insulator. CONSTITUTION:A semiconductor element 1 is mounted on inner leads 2 of a lead frame through an insulator 5. Said semiconductor element 1 and the inner leads 2 are connected through bonding wires 3. The entire body is sealed with a thermosetting- resin based molding material 4. In this resin sealed type semiconductor device, said insulator 5 comprises a thermoplastic-resin bonding agent or a thermosetting-resin bonding agent, in which an inorganic filler or an organic filler having a specified grain diameter is compounded. The facing surfaces of the semiconductor element 1 and the inner leads 2 are junctioned with said insulator 5. For example, as said filler, a material, which is obtained by fusing fine powder of glass and the like in high temperature flames and forming a spherical form with surface tension, is used. As the organic filler, spherical fine powder of epoxy resin, which is obtained by suspension polymerization is used.

Inventors

• 👤 Masaji Ogata
• 👤 Hiroyuki Hozoji
• 👤 Hidetoshi Abe
• 👤 Masanori Segawa
• 👤 Shigeo Suzuki

Bibliographic Details