Porcelain substrate for surface mounting

Abstract

Abstract PURPOSE:To obtain a porcelain substrate for surface mounting with high reliability capable of placing a power IC element by composing the porcelain layer of a part for placing a semiconductor integrated circuit element by partly or all lacking it. CONSTITUTION:A porcelain substrate 1 for surface mounting has a laminated plate formed by laminating copper or copper alloy layers 3 and 4 on both side surfaces of a core material 2 made of Fe-Ni alloy and preferably a clad material 9 in which these three layers are cladded, a region porcelain layer 7 slightly larger than an IC element 13 is lacked in a part for placing the element 13 of the layer 7, and the element 13 is placed directly on the layer 3 or a thin metal layer 5 in the lacked part 11. Accordingly, the matching of the thermal expansion coefficient of the element 12 (Si chip) to the material 9 is enhanced, and the thermal dissipation is largely improved to prevent the Si chip bonded part from releasing and the Si chip from damaging (cracking).

Inventors

• 👤 Fumiya Numajiri
• 👤 Kenji Yamaguchi

Bibliographic Details