Cooling device for semiconductor element

Abstract

Abstract PURPOSE:To contrive the improvement in cooling effect of a high heating element by installing a concentrated cooling means for further applying a high- pressure jet to said high heating element. CONSTITUTION:In addition to a common cooling means 6 for uniformly cooling elements 1a and 1b of a printed circuit board 2, a concentrated cooling means 10 of high pressure is arranged. An air flow A produced by driving a fan 4 goes in a chamber 5 of the elements 1a and 1b at predetermined velocity and amount of air flow and the elements 1a and 1b are exposed to this air flow A to be cooled down. At this time, a fan 8 of the means 10 is driven simultaneously so that a high-pressure air is led along a path 7 to be spouted toward the high heating element 1b through an outlet 9. In addition to the air flow A, the element 1b is exposed to this more intense jet B and is sufficiently cooled down.

Inventors

• 👤 Kenji Nishiura
• 👤 Junko Kaneko

Bibliographic Details