Sputtering device of planar magnetron system

Abstract

Abstract PURPOSE:To desirably change the magnetomotive forces of respective magnetic polar bodies and to obtain a sputtered film having distribution of uniform film thickness deposited on an objective substrate for film formation by providing a first-third magnetic polar bodies to the center part of a target material in a vacuum tank, the inner and outer parts around it and controlling them throughly separately. CONSTITUTION:The electrode part of the titled device is constituted by fixing a circular target plate 21 to a packing plate 22 made of copper which is provided with a flow path 34 for cooling to the rear side and made to a cathode e.g. by brazing and providing a magnetic field generating yoke 23, an inner electromagnet coil 24, an outer electromagnet coil 25, a central magnetic polar end 26, an inner magnetic polar end 27, an outer magnetic polar end 28, an electrode support 30, an O-ring 31, a shielding 32 made to an anode and insulating spaces 33 as a means for generating the prescribed magnetic flux distribution in the hollow space on a first main surface of the target plate 21 and providing a first-third magnetic polar bodies controllably so that required magnetomotive forces are generated. Then a sputtered film having uniform film thickness is formed by impressing voltage between the anode 32 and the cathode 22 and changing the magnetomotive forces of respective magnetic polar bodies independently and desirably and performing operation so as to form the required film thickness distribution on an objective substrate for film formation.

Inventors

• 👤 Hide Kobayashi
• 👤 Katsuo Abe
• 👤 Tsuneaki Kamei
• 👤 Hideki Tateishi
• 👤 Susumu Aiuchi

Bibliographic Details