Cooling structure of package for electronic circuit

Abstract

Abstract PURPOSE: To simplify structure while reducing cost by cooling an IC element by a primary refrigerant, in which the IC element is dipped directly, and a secondary refrigerant not brought into contact with the IC element when the IC element is cooled. CONSTITUTION: One part of heat generated by IC elements 1 is transmitted over wiring substrates 2 and the residue is conducted directly over a primary refrigerant 12, and transmitted over cooling plates 5 by conduction and a convection. Heat is conducted over tubes at both ends of thermal conduction plates by conduction in the cooling plates 5, and discharged to a secondary refrigerant 6 from the tubes. Consequently, since structure in which the cooling plates 5 are not brought into contact directly with the IC elements 1 and heat is transmitted through the primary refrigerant 12 is formed, not only thermal stress by a temperature rise has no adverse effect on the connecting sections of the IC elements 1 and the wiring substrates 2 but also cooling performance is not also lowered by the dispersion of the mounting height and inclination of the IC elements 1. Accordingly, no noise, etc., is generated in a device building in a computer, etc. COPYRIGHT: (C)1989,JPO&Japio

Inventors

• 👤 Kazuhiko Umezawa

Bibliographic Details