Lead forming apparatus of semiconductor device

Abstract

Abstract PURPOSE:To make the aligning property of leads excellent after molding, by providing a lead bending stage for supporting the leads, providing a lead pusher, which can be freely moved up and down at the upper part of the lead bending stage, and forming the pushing surface of the lead pusher and the supporting surface of the lead bending stage with the surface, which is in conformity with the warping of the package of a semiconductor device. CONSTITUTION:Leads 2a of a semiconductor device 2 are supported on a supporting surface 11a of a lead bending stage 11. At this time, a lead bending punch 3 and a lead pusher 12 are positioned at the upper part of the semiconductor device 2. The Iead pusher 12 is lowered, and the leads 2a of the semiconductor device 2 are pushed on the supporting surface 11a. At this time, the supporting surface 11a of the lead bending stage 11 and the pushing surface 12a of the lead pusher 12 face the supported surface and the pushed surface of each Iead 2a. Thereafter the lead bending punch 3 is lowered, and the leads 2a of the semiconductor device 2 are bent. Thus the fabrication is performed.

Inventors

• 👤 Hirotaka Ueda
• 👤 Nobuo Eguchi
• 👤 Hideyoshi Yano
• 👤 Shuichi Osaka
• 👤 Yoshimori Tone

Bibliographic Details