Lead frame

Abstract

Abstract PURPOSE: To reduce the deformation of a lead and to decrease a malfunction, such as a wire short-circuit by forming a section formed thinner than other lead over its longitudinal direction at the outer frame of a lead frame. CONSTITUTION: A lead frame in which part of the outer frame 2 of a lead frame 1 is thinned is prepared. (This thinned recess 9 is treated by etching or the like). Then, a pellet 10 is bonded (placed) by Ag paste on a tab 3. Then, a wire 11 is bonded by thermal press-bonding or the like. Even if a force F as shown in the drawing is applied in this state, since the recess 9 is formed thinner than the other section, the recess 9 is deformed due to its weak strength. If the force F is absorbed by the deformation of the recess 9, the deformation of inner leads 6 can be reduced. Thus, the deformation of the wire 11 upon deformation of the inner leads can be decreased. COPYRIGHT: (C)1989,JPO&Japio

Inventors

• 👤 Hideaki Kimura

Bibliographic Details