High frequency socket

Abstract

Abstract PURPOSE:To uniformize pressing force applied to leads and to facilitate the assembling/disassembling of an IC by using protruding parts of blocks held fittingly on an upper box so as to press a contact of IC leads to electrode contact pieces in a lower box. CONSTITUTION:An upper box 1 and a lower box 2 are supported by an axis on their facing ends. After an IC3 is inserted into a package insertion groove 4 of the lower box 2, the upper box 1 is turned down to be superposed on the lower box 2 and next they are locked by a grip 8. Protruding parts 6a of blocks 6 held fittingly on the lower box by springs 7 are projected into leads 4a to touch drawn parts of leads 3a, and spring 7's pressing force is applied to the leads 3a, so that tip parts of the leads 3a contact with a large plate shaped electrode contact piece 5 with proper contact pressure. Each block 6 is formed to block each group of the leads 3a disposed on both sides of the IC3, and pressure is applied uniformly to the group of the leads 3a on one side.

Inventors

• 👤 Noriko Yamauchi

Bibliographic Details