Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To improve the bending accuracy of lead pieces thereby to prevent a gap between the lead pieces and sealing resin from being formed by bending in advance the lead pieces reversely to a normal direction at the position for bending the lead piece, and then bending it in the normal direction. CONSTITUTION:A lead piece 1 is bent in a reverse direction E to a normally bending direction D by a known bending die, the piece 1 is then bent to the previous state of next bending, and further bent to the normal angle to the normal direction D. That is, a reverse bending stress is applied in advance along the substantially bending line of the piece 1 to be bent in the later step to reduce the bending stress at the time of bending it in the normal direction. Thus, a tensile strength and the bending stress applied to the piece 1 are relatively weakened to prevent the generation of a gap between the piece 1 and sealing resin 3 and the irregularly bending of the pieces 1 from occurring.

Inventors

• 👤 Kaoru Ishihara
• 👤 薫 石原

Bibliographic Details