Manufacture of semiconductor integrated circuit

Abstract

Abstract PURPOSE:To simplify a burring operation, by performing heat-resisting sealing and heat-resisting coating on or between leads parts of a lead frame and thereafter performing resin molding. CONSTITUTION:Heat-resisting seals 5 are stuck beforehand or heat-resisting resin coating is applied to both surfaces of lead parts 3 and between the leads parts 3 which are required to be protected from burs 6 on a lead frame 2. Then, die bonding and wire bonding of an IC chip are performed on this lead frame 2, and the whole is molded with resin. Because the burrs 6 are stuck on the heat-resisting seal 5 or the coating material, these heat-resisting seal 5 or heat-resisting coating material are peeled after the completion of molding and so the burrs 6 can be easily removed.

Inventors

• 👤 Hideo Kameda
• 👤 亀田　英夫

Bibliographic Details