Semiconductor printing apparatus

Abstract

Abstract PURPOSE:To obviate waste of time due to use of instruments exclusively for measurement and to obviate errors due to difference in operating environments, by using patterns printed on a wafer for measuring the positioning and die-array accuracy of an X-Y stage and by correcting the target position based on measured data. CONSTITUTION:In the first layer of a wafer WF, not only a circuit pattern on a reticule RT but also an alignment mark used for aligning layers from the second layer on is printed on the wafer. A reference wafer is selected from those wafers which have been subjected to this process. The reference wafer is disposed on an X-Y stage XYS and the step-and-repeat is carried out. During this process, the alignment mark is measured by means of mirrors MR, ML and photoelectric detectors DR, DL to obtain an arrangement of the patterns printed on the wafer WF. The measured data of the positioning and die-array accuracy is displayed on a console CR or outputted from a printer PR, while it is also transferred to a host computer controlling a plurality of semiconductor printing devices, so that the positioning accuracy on the X Y stage can be always controlled constantly by the host computer.

Inventors

• 👤 Hajime Igarashi
• 👤 一 五十嵐

Bibliographic Details