Fpackage for integrated circuit

Abstract

Abstract PURPOSE:To improve a heat transfer rate by disturbing the flow of a refrigerant, and to enhance cooling capacity by narrowing the width of one part of a duct line for cooling at least one position in an integrated circuit package on which an integrated circuit chip is loaded. CONSTITUTION:Heat generated in an integrated circuit chip 1 is carried away to the outside by a refrigerant 10b flowing through a duct line 4 for cooling through a structure 2. The refrigerant 10 is distributed to the duct line 4 for cooling by a refrigerant distributing section 8, and the heated refrigerant 10b is collected by a refrigerant collecting section 9, and flowed out to the outside. Through-holes 3a electrically connecting a wiring layer 2a and I/O pins 5 are arranged zigzag, the width of duct partition walls 11 for cooling is thickened and formed to a rectangular shape in the vicinity of the through-holes 3a, and the width of duct lines 4a for cooling in the vicinity of the through-holes 3a is narrowed. Accordingly, a refrigerant 10e meanders and flows, and a flow thereof is dusturbed and the development of a thermal boundary layer is inhibited.

Inventors

• 👤 Toru Kishimoto
• 👤 亨 岸本

Bibliographic Details