Coating and developing equipment for resist material

Abstract

Abstract PURPOSE:To reduce the floor space of the title coating and developing equipment by a method wherein at least exceeding two stages out of four component stages i.e. a stage for feeding wafers, a stage for spincoating wafers with resist or developing wafers, a stage for heat treating wafers and a stage for receiving wafers are vertically arranged to be connected in the vertical direction. CONSTITUTION:A coating equipment is arranged with a stage 3a setting up a carrier 2a containing wafers 1 to be coated with resist on the topmost step; a stage 3b equipped with a spincoater 5 on the third step; a stage 3c equipped with a hot plate 6 for prebaking wafers 1 on the second step; and a stage 3d setting up another carrier 2b to receive wafers 1 on the first step. In such a constitution, respective stages are connected in the vertical direction while fork lifts 4a, 4b, 4c are respectively provided between the stage 3a and 3b, 3b and 3c, 3c and 3d in the vertical direction to lower the wafers 1.

Inventors

• 👤 Takeo Hashimoto
• 👤 橋本　武夫

Bibliographic Details