semiconductor equipment

Abstract

Abstract PURPOSE:To avoid soft errors induced by the creation of alpha-particles (alpha-beam) by a method wherein the main surfaces of the respective semiconductor chips of the outermost part are so arranged as to face each other and insulation is provided between the respective semiconductor chips and the input/output electrodes of the respective semiconductor chips are connected to the leads for electrical connection with an external device by tape carriers. CONSTITUTION:The main surfaces 1A and 3A of 1st and 2nd semiconductor chips 1 and 3 are so arranged as to face each other and insulating adhesive 5 is provided between them and the protruding electrodes 1B and 3B of the respective 1st and 2nd semiconductor chips 1 and 3 are connected to the leads 6 and 7 for electrical connection with an external device by tape carriers 2 and 4. With this constitution, the respective main surfaces 1A and 3A of the 1st and 2nd semiconductor chips 1 and 3 are so arranged as to face each other and the back surfaces of the 1st semiconductor chip 1 and the 2nd semiconductor chip 3 are made to face to the direction of the package of a multi-chip module so that soft errors induced by the creation of alpha-particles (alpha-beam) can be avoided.

Inventors

• 👤 Takeshi Fukazawa
• 👤 深澤　武
• 👤 Osamu Takahashi
• 👤 収 高橋

Bibliographic Details