Bumpless film carrier

Abstract

Abstract PURPOSE:To reduce bonding damages and avoid electrostatic breakdown by a method wherein Al electrodes of a semiconductor chip are used for connections with leads without forming bumps such as Au bumps on the Al electrodes. CONSTITUTION:An anisotropic conductive film 8 is provided above a semiconductor element 1 which has Al electrodes 9, and finger leads 2 for chip bonding of a resin tape 4 are bonded on the anisotropic conductive film 8. By connecting the electrodes 9 to the external leads, the wirings in the chip can be drawn out. The anisotropic conductive film 8 is a film with oriented conductivity. It has conductivity along the thickness direction (vertical direction) of the film 8 but functions as nonconductor or insulator along the longitudinal direction of the film 8. As for the anisotropic conductive film 8, a polymer film made of electrical insulating resin such as diallylphthalate resin in which conductive particles such as carbon black/silver are disperesed is an example.

Inventors

• 👤 Yoshiaki Wakashima
• 👤 若島　喜昭
• 👤 Toshikazu Narahara
• 👤 奈良原　俊和
• 👤 Koji Serizawa
• 👤 弘二 芹沢
• 👤 Hirohito Kawagoe
• 👤 川越　紘人

Bibliographic Details