Cooling structure of semiconductor device

Abstract

Abstract PURPOSE:To improve the cooling efficiency by a method wherein a fin forming a circulation path for circulating a refrigerant to each semiconductor device is installed and additionally its outer circumference is covered with a magnetic seal having a magnetic fluid so that the fin can be attached and detached from a cooling plate. CONSTITUTION:A fin 6 which is equipped with a circulation path 5A for a refrigerant in its inside is fixed to the surface of a semiconductor device 2 which is mounted on a printed-circuit board 1 by welding, glueing or soldering so that an outer circumference 5B of the fin 5 can be covered with a magnetic fluid 6A which is held by an N magnetic pole 8A and an S magnetic pole 8B. The refrigerant which has flowed through a flow path 3A at a cooling plate 3 in the direction as shown by an arrow F1 flows through a nozzle 11 into the circulation path 5A as shown by an arrow F2. The refrigerant flows from the circulation path 5A in the direction as shown by an arrow F3 so that the refrigerant does not leak due to the interception of the magnetic fluid 6A at a magnetic seal 6. Therefore, the refrigerant can flow directly through the fin 5. In addition, because a part E where the surface of the semiconductor device 2 comes into contact with the fin 5 is fixed, the thermal conductivity is increased and the cooling efficiency can be improved.

Inventors

• 👤 Izumi Ono
• 👤 泉 小野

Bibliographic Details