Epoxy resin composition for use in sealing semiconductor

Abstract

Abstract PURPOSE:To provide the title compsn. which has excellent water resistance and hardly causes stress due to cure shrinkage during molding, consisting of an epoxy resin and a specified polyvinylidene fluoride. CONSTITUTION:100pts.wt. novolak type epoxy resin is blended with 1-20pts.wt. polyvinlidene fluoride powder having an m.p. of not lower than 150 deg.C, 250-500 pts.wt. inorg. filler (e.g., silica), 20-100pts.wt. curing agent having phenolic hydroxyl groups (e.g., phenolic novolak) and optionally, a silane coupling agent (e.g., 3-glycidoxypropyltrimethoxysilane), a curing accelerator (e.g., 2- methylimidazole), a parting agent, a flame retarder, a colorant, etc. The mixture is kneaded at 60-80 deg.C.

Inventors

• 👤 Kota Nishii
• 👤 耕太 西井
• 👤 Azuma Matsuura
• 👤 東 松浦
• 👤 Yukio Takigawa
• 👤 幸雄 瀧川
• 👤 Yoshihiro Nakada
• 👤 義弘 中田

Bibliographic Details