Manufacture of hybrid integrated circuit

Abstract

Abstract PURPOSE:To obtain a large power hybrid integrated circuit to which a large current is applied by a method wherein a printed wiring substrate is covered with a heat radiation shielding mask and infrared radiation is applied to a semiconductor chip only through an aperture to solder the semiconductor chip. CONSTITUTION:Solder cream is applied to predetermined positions on the conductor foils of a printed wiring substrate 1 and chip electronic components such as a chip resister 2, a chip capacitor 3, a chip IC 4 and a chip transistor 7 and only a heat spreader 6 without a semiconductor chip 5 are mounted and soldered. Then solder cream which does not contain chlorine ions is applied to the heat spreader 6 and the semiconductor chip 5 is mounted on the heat spreader 6. Then, by using a heat radiation shielding mask 10, infrared radiation from an infrared lamp 9 is applied through an aperture 10a only to the semiconductor chip 5 to solder the semiconductor chip 5 onto the heat spreader 6.

Inventors

• 👤 Akira Honda
• 👤 晃 本多

Bibliographic Details