Manufacture of resin sealed semiconductor device

Abstract

Abstract PURPOSE:To realize a dam-bar function and to make it removable, by identifying an inner end edge of a dam-bar with a peripheral line of a resin body and forming a half-cut part on a position of each outer lead purpose line on the upper side of the bar. CONSTITUTION:An inner end edge 38 of a dam-bar 26 is identified with a peripheral line 42 of a resin body 40, and a half-cut part is formed on a position of each outer lead purpose line on the bar 26. The bar 26 is pressed to be floated in degree of half thickness of the outer lead 22. When resin sealing is performed by using this lead frame, the bar 26 floated upon the fastening of the mold is pushed back again to a lead 22 plane. Accordingly protrusion of the resin does not occur. The dam-bar pushed back in reverse is in a much easier state to be detached and so it can be detached easily by a small force by hand or with a bar or the like.

Inventors

• 👤 Yoshiharu Koizumi
• 👤 祥治 小泉

Bibliographic Details