Resin sealed semiconductor device

Abstract

Abstract PURPOSE:To require no bending process of an external lead frame and to make this device structurally not subject to damage, by making the external lead exposed from a bottom part of sealing resin. CONSTITUTION:A resin sealed part of a lead frame 2 fixed with a tie bar 6 is processed in advance as shown in a sectional view, and a die frame 3 is set to be positioned according to the processed frame 2 and it is fixed on the tie bar 6. After a semiconductor element 4 with several functions made therein is mounted on the die frame 3, a bonding pad part on the element 4 is connected to an upper side of the frame 2 by the use of bonding wires 5. Further, resin 1 is used to seal this device in a prescribed shape, and next needless parts of the tie bar are cut out. Hence the device does not require a bending process of the lead frame after the sealing process and so it is not subject to damage.

Inventors

• 👤 Yoshitomo Kimura
• 👤 木村　佳友
• 👤 Tsutomu Hata
• 👤 務 秦

Bibliographic Details