Flip chip bonding

Abstract

Abstract PURPOSE:To bond the electrodes of a wiring board directly intact with the bumps of a semiconductor chip by a method wherein the wiring board is heated and pressure and an ultrasonic wave are added from the rear of the semiconductor chip. CONSTITUTION:A semiconductor chip 1 is first attracted its rear by a tool 8 having an attracting groove 7 mounted at the point part of an ultrasonic horn and thereafter, a wiring board 10, which is put on a table 9 heated at 20 deg.C-300 deg.C and consists of glass, for example, is made to correspond to Al electrodes 2 of the chip 1. Electrode parts 11 consisting of Al, for example, are aligned to bumps 6 of the chip 1 and pressure (P) and an ultrasonic wave (U.S) are added to the tool 8 to bond the electrode parts 11 of the board 10 to the bumps of the chip 1. In such a way, the board 10 is heated and by adding the pressure and the ultrasonic wave from the rear of the chip 1, the need to form a solder paste on the electrode parts 11 of the board 10 is eliminated.

Inventors

• 👤 Yoshifumi Kitayama
• 👤 北山　喜文
• 👤 Yukio Maeda
• 👤 幸男 前田

Bibliographic Details