Semiconductor device

Abstract

Abstract PURPOSE:To dispense with working of leads and supply of bonding material by a method wherein brazing material is applied to through-holes and peripheral parts. CONSTITUTION:A semiconductor element 6 is fixed to an insulating substrate 1 through a bonding agent 5 and connected electrically with a bonding wire 7, which is packaged with a resin mold 8. A spherical brazing material protrusion 9, which is formed in a soldering processing device such as a melting solder cell, is coated over a through-hole 3 and a rear land section 4. When the processing condition is kept constant, the protrusion 9 varies according to the diameter of the hole 3 and the area of the land section 4. The said brazing material 9 is used as bonding material when a mounting process is performed onto a printed substrate or the like. By these processes, when a mounting process is performed onto a printed substrate or the like, supply of a brazing material and a lead forming processing such as a tie-bar cut or the like can be dispensed with.

Inventors

• 👤 Shoji Takano
• 👤 高野　捷二

Bibliographic Details