Photosensitive resin composition

Abstract

Abstract PURPOSE:To obtain the titled composition capable of forming a solder mask having high reliability by incorporating a specified photopolymerizable unsatd. compd., a sensitizer capable of forming a free radical by an active ray and/or a sensitizer series in the titled composition. CONSTITUTION:The titled composition contains the photopolymerizable unsatd. compd., the sensitizer capable of forming the free radical by the active ray and/or the sensitizer series, and said photopolymerizable unsatd. compd. is obtd. by allowing isocyanate ethyl methacrylate to react with the hydroxy group contd. in a hydroxystyrene polymer in an equivalent molar ratio of isocyanate to hydroxy group of 0.1-1.2. In formula I, D is comonomer, (m) is a positive integer, (n) is 0 or a positive integer, the OH group has an ortho, a para or a metha position against a main chain. Thus, the titled composition which is usable for a permanent protective film such as the solder mask, etc., is obtd.

Inventors

• 👤 Katsunori Tsuchiya
• 👤 勝則 土屋

Bibliographic Details