Bonding of semiconductor chip

Abstract

Abstract PURPOSE:To realize a junction making use of the characteristic of a flexible printed circuit board (FPC) by using commonly the jig of a usual wire-bonder, by a method wherein a retaining substrate and a semiconductor chip are bonded with a minute ball made of metal thin wire. CONSTITUTION:When a wiring formed on a retaining substrate, and an electrode part 4 formed on a semiconductor chip 1 are bonded, a metal thin wire 5 is drawn out from a capillary 8 arranged on the electrode part 4, and a minute ball 11 is made at the tip of the metal thin wire 5. Then, the capillary 8 and the meal thin wire 5 are made to descend. Thereby, the minute ball 11 and the electrode part 4, and the capillary 8 and the minute ball 11 are, respectively, brought into contact with each other, and the minute ball 11 and the electrode part 4 are bonded. The capillary 8 is made to ascend to pull up the metal thin wire 5, and the metal thin wire 5 and the minute ball 11 are cut off. The minute ball 11 on the semiconductor chip 1 and a wiring 3 on the retaining substrate are aligned and brought into contact with each other to be bonded. Thereby, even in the case where the retaining substrate is an FPC, the bonding is enabled wherein the flexibility as the characteristic of FPC is exhibited.

Inventors

• 👤 Gihei Ikegawa
• 👤 池側　義平

Bibliographic Details