Semiconductor device

Abstract

Abstract PURPOSE:To enable stable supply of power to the elements on a semiconductor chip by placing power supply leads along the outer periphery of the chip, thereby shortening the wire for connecting the power supply terminal pads and the power supply leads on the chip so as to make the resistance and inductance small. CONSTITUTION:On the edge around a semiconductor chip 1 a plurality of power supply terminal pads 2 are placed, and signal leads 4 are placed outside the semiconductor chip 1. And, along the outer periphery of the semiconductor chip 1, power supply leads 5 are placed surrounding the semiconductor chip 1, and the power supply terminal pads 2 and the power supply leads 5 are connected by a conductive metal wire 6. With this constitution, at whatever positions the power supply terminal pads 2 are, the power supply leads exist opposite thereto, so both can be connected at the shortest distance. And the upper parts of T-shaped power supply leads 5a-5d may also be placed opposite to the respective sides of the semiconductor chip 1. With this, the power supply terminal pads can be connected to any of the power supply leads 5a-5d at the shortest distance.

Inventors

• 👤 Seishi Momose
• 👤 百瀬　聖之

Bibliographic Details