Plasma treatment apparatus

Abstract

Abstract PURPOSE:To uniformly execute a plasma treatment of even a large-diameter substrate by a method wherein an electric current to be made to flow through a first solenoid coil and a second solenoid coil is controlled time-wise and the electric currents whose phases differ from each other are made to flow in succession through each coil of the solenoid coils so that the straight-line motion or the rotary motion of a plasma flow can be made possible in a wide region. CONSTITUTION:When high-frequency electric power is supplied by a magnetron 9 which is connected to a driving power supply 8, a high-frequency waveguide 7 forms a high-frequency electric field which is perpendicular to the axial direction; a gas is supplied to a glass tube 10. An electron in a plasma generated at a plasma generation part 1A is accelerated in the axial direction toward a plasma reaction part 11. If a waveform of an electric current to be supplied to a first solenoid coil 6 and a second solenoid coil 17 is changed time-wise and a rotary magnetic field is formed, a plasma flow 15 is rotated; accordingly, an amorphous silicon film whose film thickness is distributed uniformly is formed on a large-diameter substrate 13 in the plasma reaction part 11.

Inventors

• 👤 Toshihiko Minami
• 👤 利彦 南
• 👤 Koichiro Nakanishi
• 👤 幸一郎 仲西
• 👤 Hiroki Odera
• 👤 廣樹 大寺
• 👤 Minoru Hanazaki
• 👤 花崎　稔

Bibliographic Details