Semiconductor device

Abstract

Abstract PURPOSE:To eliminate capacitance and continuity resistance caused by package material and dimension, the speed failure by the effect of inductance, and the decrease of isolation, gain and resonance frequency, by connecting directly a chip pad part and the wiring part of a printing wiring board with an optical fibre. CONSTITUTION:From outside an electric signal is input to an optical modulator 12 at the input of an optical fiber terminal 11. An optical modulator 12 or an optical demodulator 14 composed of a laser diode or a light emitting diode can easily perform an intensity modulation by superposing a bias current of the diode. The converted optical signal passes the optical demodulator 14, at the end-portion of the terminal which converts the optical signal to an electric signal. This signal is input into a circuit in the inside of a chip 7. The electric signal processed by electronic circuits passes the optical modulator 12 via an output pad 16, and is converted to an optical signal. After that, it passes through the optical fibre terminal 11, and is converted to an electric signal by the optical demodulator 14 outside the package. Thus the electric signal is delivered to the conductor of a printed wiring board.

Inventors

• 👤 Katsuhiko Suzuki
• 👤 勝彦 鈴木

Bibliographic Details