Cooling apparatus for heating element

Abstract

Abstract PURPOSE:To perform sufficient heat radiation and to suppress increase in size of an apparatus, by sealing low-melting-point alloy in a second heat conducting container, providing heat radiating fins on the outer surface, and radiating the heat from both surface sides of a substrate. CONSTITUTION:A first heat conducting container 7, which covers the outer parts of LSI chips 1, is provided on the upper surface of a substrate 3. The heat conducting container 7 is molded with, e.g., a metal plate. The lower end of the container is welded to the substrate 3. An upper part 7a is formed in a fin shape. Refrigerant 9 is sealed in the heat conducting container 7. A second container 11 is provided on the lower surface of the substrate 3. The heat conducting container 11 is formed : on the substrate 3 by welding a metal cap material 13 to the lower surface of the substrate 3. Indium alloy 15 and the like are sealed in the container as low-melting-point alloy. A space 17, which permits expansion when the indium alloy 15 is transformed into liquid, is formed at each outer end of the cap material 13. Heat radiating fins 19 are formed on the outer surface of the cap material 13 as a unitary body.

Inventors

• 👤 Masaru Ishizuka
• 👤 勝 石塚

Bibliographic Details