Semiconductor device

Abstract

Abstract PURPOSE:To eliminate restrictions against the directions of bonding of metal fine wires and improve the frequency characteristics by a method wherein a frame part is provided around the pellet mounting part of the lead frame of a semiconductor device and predetermined leads of the lead frame and the frame part are used in one piece. CONSTITUTION:A semiconductor pellet 2 is mounted on the semiconductor pellet mounting part 1 of a lead frame and a frame part 3 is provided so as to surround the circumference of the mounting part 1. Also, a number of leads are provided so as to surround the circumference of the frame part 3. Grounding leads 4E are grounded and unified with the frame part 3 and drawn outward from the positions facing each other to the directions opposite to each other. Further, among four electrodes at four corners of the pellet 2, a pair of electrodes on one diagonal are connected to the nearest leads 4 with metal fine wires 5. On the other hand, one side ends of two pairs of metal fine wires 5E are connected to a pair of electrodes on the other diagonal and the other ends are divided into two and connected to suitable points on the frame part 3 to reduce lead inductances and improve the high frequency characteristics.

Inventors

• 👤 Kei Shiratori
• 👤 白鳥　慶

Bibliographic Details