Lead for semiconductor device

Abstract

Abstract PURPOSE:To eliminate the trouble of the damage of a molding package in a lead bending process, to improve yield and to obtain a semiconductor device having excellent quality by forming a curved section protruded to a section outer than a free end section between the free end section and a lead leading-out end for the molding package. CONSTITUTION:Curved sections 17b protruding beyond free end sections 17a are shaped among the free end sections 17a and lead leading-out ends 16a for a molding package 16 in leads 17 for a dual-in-line package type semiconductor device, the free end sections 17a of which are directed downward. Consequently, stress does not concentrate to the lead leading out ends, defectives by a lead bending process are removed, and yield can be improved. Even when the size of the molding package is scaled up, the intervals of the leads can be ensured according to standard size.

Inventors

• 👤 Akinobu Inoue
• 👤 井上　明信
• 👤 Seiichi Sugimoto
• 👤 椙本　清一

Bibliographic Details