Copper foil for printed circuit and production thereof

Abstract

Abstract PURPOSE:To improve the oxidation resistance, solderability and stripping strength of Cu foil by successively plating both sides of the foil in a plating bath contg. Zn ions and in a plating bath contg. Cr<+6> and molybdic acid ions and by applying a silane coupling agent to the rough side of the plated foil. CONSTITUTION:Cu foil is successively immersed in a first plating bath contg. Zn ions and in a second plating bath contg. molybdic acid ions and sexivalent Cr ions to form Zn or Zn oxide-base thin films on the lustrous side by 30-200mug/dm<2> (expressed in terms of Zn) and on the rough side by 10-250mug/dm<2> and mixed thin films contg. Mo or Mo oxide and Cr or Cr oxide as essential components on the Zn or Zn oxide-base thin films. The mixed thin film on the lustrous side contains 5-50mug/dm<2> Mo and 5-50mug/dm<2> Cr. The mixed thin film on the rough side contains 10-250mug/dm<2> Mo and 10-150mug/dm<2> Cr. A silane coupling agent is then applied to the rough side of the plated Cu foil.

Inventors

• 👤 Seisaku Hayashi
• 👤 林　誠作
• 👤 Yasuyuki Suzuki
• 👤 康之 鈴木
• 👤 Masatoshi Hayashi
• 👤 正敏 林

Bibliographic Details