Semiconductor device

Abstract

Abstract PURPOSE:To facilitate automatic assembly and transportation and to enable semiconductor devices to be produced in mass, by mounting semiconductor element chips on respective chip carriers arranged in series on a carrier strip which can be divided in a chocolate breaking manner and connecting wires to the chips. CONSTITUTION:A carrier strip 10 formed of an insulating material such as ceramics is provided with a plurality of chip carriers 1 formed in series and integrally therewith so that the carrier strip 1 has a shape of elongated plate. Slits 11 are formed at equal spaces along the length of the carrier strip 10. Each chip cap 1 is provided with a recess 2 at the center of the top thereof, and leads 3 of a conductive material are extended from the periphery of the recess to the outer periphery and the bottom of the chip cap. The leads 3 are formed by forming through holes 12 in the carrier strip 10 and performing metallization. The chip carriers 1 are obtained by dividing the carrier strip in a chocolate breaking manner by utilizing the slits 11.

Inventors

• 👤 Masahiko Kadowaki
• 👤 正彦 門脇
• 👤 Kiyoshi Oide
• 👤 大出　喜義
• 👤 Akiya Izumi
• 👤 泉　章也
• 👤 Toshio Nakano
• 👤 中野　寿夫
• 👤 Toshiki Suzuki
• 👤 鈴木　敏樹

Bibliographic Details