Resin-sealing metallic mold in semiconductor-manufacturing equipment

Abstract

Abstract PURPOSE:To realize a decrease in cost, by making many cavity inserts having cavities be mounted on a retainer to be freely movable, and making spacers for regulating each cavity pitch between the cavity inserts be mounted there to be freely assembled/disassembled. CONSTITUTION:Each cavity pitch P between cavity inserts 11 can be corrected by using spacers 14 whose thickness varies in accordance with each material of IC lead frames. Thus, the cavity pitch P between the cavity inserts 11 can be made identical with the chip pitch displaced by thermal expansion of the lead frame. When a resin-sealing metallic mold is assembled in a semiconductor manufacturing equipment, the cavity inserts 11 are mounted on the retainer 12 so that their cavity pitches P are identical with the chip pitches on the IC lead frame, and besides the spacers 14 are interposed between these cavity inserts 11.

Inventors

• 👤 Takesuke Eda
• 👤 江田　武資
• 👤 Suekichi Tanaka
• 👤 田中　末吉

Bibliographic Details