Semiconductor integrated circuit

Abstract

Abstract PURPOSE:To prevent that noise generated in a digital circuit part is transmitted to an analog circuit part by a method wherein the analog circuit part and the digital circuit pat are formed on upper and lower separated substrates three-dimensionally and both substrates are isolated electrically and shielded. CONSTITUTION:A first interlayer insulating film 40 is formed on an analog integrated circuit at a substrate 34; a metal film 41 is formed on the insulating film 40. The metal film 41 is connected to a grounding electrode of an analog circuit part for the analog integrated circuit through a wiring layer 48 at a through hole formed on the insulating film 40; the analog integrated circuit is shielded. A second interlayer insulating film 42 is formed on the metal film 41; a polycrystalline silicon film is formed on the insulating film 42; polycrystalline silicon is made to be of single crystalline; a silicon layer 43 is formed. A digital integrated circuit is formed on the silicon layer 43. By this method, it is possible to prevent that noise generated in a digital circuit part is transmitted to the analog circuit part.

Inventors

• 👤 Hideyoshi Shimura
• 👤 志村　秀吉

Bibliographic Details