Cooling of semiconductor device

Abstract

Abstract PURPOSE:To obtain a large cooling effect equal to a dipping cooling method without scaling up the structure of a cooling section by using a sealed vessel by passing a refrigerant introduced by a pipe into an internal path in the base body of a semiconductor device. CONSTITUTION:A refrigerant 40 is fed into a pipe 38 as shown in the arrow A, and divided into two directions, one flows in a path 27-1, a pipe 34, a path 27-2, a pipe 35 and a path 27-3 in succession, and the other successively flows in a path 27-4, a pipe 36, a path 27-5, a pipe 37 and a path 27-6. The refrigerant takes heat especially when it flows in a loop-shaped path 27c at the center, thus efficiently cooling each semiconductor device 20-1-20-6 from the insides.

Inventors

• 👤 Akira Watanabe
• 👤 綿奈部　章

Bibliographic Details