Hybrid integrated circuit device

Abstract

Abstract PURPOSE:To automate assembly and selection processes easily while improving the accuracy of outside dimensions, and to enhance quality by bonding a circuit substrate, on both surfaces of which wirings are conducted, onto a base ribbon made of a metal. CONSTITUTION:One kind of a circuit substrate 2 in an silicon substrate, a polyimide substrate, an alumina substrate, an epoxy substrate and a glass epoxy substrate is bonded with a base ribbon 1 made of a metal by using adhesives 7. Wirings 3 are formed previously to both the surface and the back of the circuit substrate 2, and circuit elements 4 are cemented with the circuit substrate 2 by employing adhesives 5. The circuit elements 4 are connected to the wirings 3 on the circuit substrate 2 or the base ribbon 1 made of the metal or the wirings 3 on the circuit substrate 2 to the base ribbon 1 made of the metal by using metallic small-gage wires 6. The whole is sealed with a sheathing resin 8 by employing a transfer molding system.

Inventors

• 👤 Shizuo Okuda
• 👤 静男 奥田

Bibliographic Details